Wafer bonding device

Details Wafer bonding device Wafer bonding device

1997-06-26

2000-03-07

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

269 21, B25B 1100

Patent

active

060327154

ABSTRACT:
A wafer bonding device which prevents the substrate from being deformed due to the presence of any particles on the chuck surface is provided to thereby prevent a deterioration in yield in the wafer bonding process. The wafer bonding device is equipped with a substrate holding section 3 having a chuck surface 9 for holding a substrate 1, which is one of two substrates 1 and 2 to be bonded together, and the other substrate 2 is bonded to the substrate 1, which is held by the chuck surface 9, wherein a suction member 8 engaged with a support member 4, forming the substrate holding section 3, is formed of a porous material, whereby minute recesses of a predetermined size are formed in high density on the chuck surface 9 of the substrate holding section 3, and any particles are captured in these minute recesses.

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patent: 5857667 (1999-01-01), Lee
patent: 5923408 (1999-07-01), Takabayashi

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