Wafer bonded pressure sensor

Details Wafer bonded pressure sensor Wafer bonded pressure sensor

2007-06-26

2007-06-26

Lefkowitz, Edward (Department: 2855)

Measuring and testing

Fluid pressure gauge

Electrical

C073S715000, C073S716000, C073S753000

Reexamination Certificate

active

10965904

ABSTRACT:
A pressure sensor (30) for sensing a fluid pressure in harsh environments such as the air pressure in a tire, by using a first wafer substrate (32) with a front side and an opposing back side, a chamber (58) partially defined by a flexible membrane (50) formed on the front side and at least one hole (33) etched from the back side to the chamber (58);a second wafer (31) on the back side of the first wafer (32) to seal the at least one hole (33); wherein,the chamber (58) containing a fluid at a reference pressure, such that the flexible membrane (50) deflects due to pressure differentials between the reference pressure and the fluid pressure; and,associated circuitry (34) for converting the deflection of the flexible membrane (50) into an output signal indicative of the fluid pressure; wherein,the second wafer (31) is wafer bonded to the first wafer substrate (32).Wafer bonding offers an effective non-adhesive solution. It provides a hermetic seal with only minor changes to the fabrication procedure. Skilled workers in this field will readily understand that the most prevalent forms of wafer bonding are:direct wafer, or silicon fusion, bonding;anodic, or electrostatic Mallory process bonding; and,intermediate layer bonding.

REFERENCES:
patent: 5285097 (1994-02-01), Hirai
patent: 5853020 (1998-12-01), Widner
patent: 5964821 (1999-10-01), Brunts et al.
patent: 6405132 (2002-06-01), Breed et al.
patent: 6484080 (2002-11-01), Breed et al.
patent: 6526352 (2003-02-01), Breed et al.
patent: 6533316 (2003-03-01), Breed et al.
patent: 6648367 (2003-11-01), Breed et al.
patent: 6662642 (2003-12-01), Breed et al.
patent: 6733036 (2004-05-01), Breed et al.
patent: 6738697 (2004-05-01), Breed
patent: 6741169 (2004-05-01), Magiawala et al.
patent: 6758089 (2004-07-01), Breed et al.
patent: 6768944 (2004-07-01), Breed et al.
patent: 261972 (1988-03-01), None
patent: 502306 (1992-09-01), None
patent: 756164 (1997-01-01), None
patent: WO 2003/106952 (2003-12-01), None

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