Wafer blade contact monitor

Details Wafer blade contact monitor Wafer blade contact monitor

2005-05-10

2005-05-10

Crawford, Gene O. (Department: 3651)

Conveyors: power-driven

Conveyor section

Reciprocating conveying surface

C198S468200, C198S468500, C700S258000, C414S222070, C414S222130

Reexamination Certificate

active

06889818

ABSTRACT:
A method and apparatus are provided for detecting contact between a wafer blade of a wafer-handling robot and a component in a wafer-handling system. The robot moves the wafer blade within the system while the wafer blade is maintained at an electrical potential, which is different from an electrical potential of the component. Contact between the wafer blade and the component is detected by sensing a change in the electrical potential of the wafer blade during the contact.

REFERENCES:
patent: 5510993 (1996-04-01), Williams et al.
patent: 6454327 (2002-09-01), Chang
patent: 6514033 (2003-02-01), Sundar
patent: 6604624 (2003-08-01), Hirata et al.

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