Wafer binding method and apparatus

Details Wafer binding method and apparatus Wafer binding method and apparatus

1993-06-14

1994-05-10

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Chamber enclosing work during bonding and/or assembly

156153, 156285, 156493, 511311, 134 76, B32B 3100

Patent

active

053104412

ABSTRACT:
The present invention relates to a method and an apparatus for automatically binding a silicon wafer to a carrier plate. In the binding method of the present invention, the wafer is positioned underneath the carrier plate and then lifted and bonded to the carrier plate, at or below atmospheric pressure: once this is accomplished the process returns to the previous pressure. In addition, in the apparatus which performs this process, by means of a carrier means which supplies the carrier plate and wafer to the location where binding is to be carried out, the binding surface of the carrier plate and wafer are turned upward, transported and the carrier plate is flipped around in the interval between the carrier plate transportation apparatus and the binding unit.

REFERENCES:
patent: 3475867 (1969-11-01), Walsh
patent: 3492763 (1970-02-01), Walsh
patent: 3562965 (1971-02-01), Lange
patent: 4283242 (1981-08-01), Regler et al.
patent: 4316757 (1982-02-01), Walsh
patent: 4736758 (1988-04-01), Kusuhara
patent: 4936328 (1990-06-01), Yatabe
patent: 5081795 (1992-01-01), Tanaka et al.
patent: 5095661 (1992-03-01), Gill, Jr. et al.
patent: 5108532 (1992-04-01), Thein et al.

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