Wafer binding method and apparatus

Details Wafer binding method and apparatus Wafer binding method and apparatus

1991-11-29

1993-10-19

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

156154, 156286, 156382, 156556, 51277, 51281R, 134 66, B32B 3100

Patent

active

052542050

ABSTRACT:
The present invention relates to a method and an apparatus for automatically binding a silicon wafer to a carrier plate. In the binding method of the present invention, the wafer is positioned underneath the carrier plate and then lifted and bonded to the carrier plate, at or below atmospheric pressure: once this is accomplished the process returns to the previous pressure. In addition, in the apparatus which performs this process, by means of a carrier means which supplies the carrier plate and wafer to the location where binding is to be carried out, the binding surface of the carrier plate and wafer are turned upward, transported and the carrier plate is flipped around in the interval between the carrier plate transportation apparatus and the binding unit.

REFERENCES:
patent: 3475867 (1969-11-01), Walsh
patent: 3492763 (1970-02-01), Walsh
patent: 3562965 (1971-02-01), Lange
patent: 4283242 (1981-08-01), Regler et al.
patent: 4316757 (1982-02-01), Walsh
patent: 4736758 (1988-04-01), Kusuhara
patent: 4936328 (1990-06-01), Yatabe
patent: 5095661 (1992-03-01), Gill, Jr. et al.
Patent Abstracts of Japan, vol 13, No. 36 (M-790) 26 Jan. 1989 & JP-A-63 245366, Aug. 1987, English Abstract.

Affiliated with

Also associated with

Rating

Wafer binding method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer binding method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer binding method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1349080