Wafer bake apparatus

Details Wafer bake apparatus Wafer bake apparatus

2006-10-03

2006-10-03

Paik, Sang (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C118S724000

Reexamination Certificate

active

07115840

ABSTRACT:
A wafer bake apparatus includes an air flow control unit of pneumatic cylinder structure operating interlockingly with a wafer lift unit and induces the air flow between a wafer and a hot plate. Therefore, when a wafer is placed in a baking position the air between the wafer and the hot plate descends. As a result, the wafer is no longer under the influence of air resistance, and can be more accurately placed in the baking position. In addition, when the baked wafer is lifted to an unloading position, the air between the hot plate and the wafer ascends, which in turn supports the wafer and prevents the distortion of the wafer.

REFERENCES:
patent: 5834737 (1998-11-01), Hirose et al.
patent: 6129546 (2000-10-01), Sada
patent: 6969829 (2005-11-01), Tsuruno et al.

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