Wafer backing insert for free mount semiconductor polishing appa

Details Wafer backing insert for free mount semiconductor polishing appa Wafer backing insert for free mount semiconductor polishing appa

1997-11-21

1999-09-07

Utech, Benjamin

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438693, 156345, H01L 21302

Patent

active

059486996

ABSTRACT:
A wafer backing insert for use in a free mount semiconductor polishing apparatus and process is disclosed wherein the wafer backing insert behind the semiconductor substrate has a diameter less than the diameter of the semiconductor substrate being polished to allow the removal of material at the edge of the substrate to be less than the overall average removal of material across the entire substrate. In a preferred embodiment, the process of the present invention utilizing a wafer backing insert having a diameter less than the diameter of the semiconductor substrate being polished is used in combination with a first polishing step utilizing a conventional wafer backing insert to control the resulting thickness and overall TTV of the polished substrate.

REFERENCES:
patent: 3708921 (1973-01-01), Cronkhite et al.
patent: 3841031 (1974-10-01), Walsh
patent: 3857123 (1974-12-01), Walsh
patent: 4194324 (1980-03-01), Bonora et al.
patent: 4270316 (1981-06-01), Kramer et al.
patent: 4313284 (1982-02-01), Walsh
patent: 4316757 (1982-02-01), Walsh
patent: 4918870 (1990-04-01), Torbert et al.
patent: 4954142 (1990-09-01), Car et al.
patent: 5193316 (1993-03-01), Olmstead
patent: 5571373 (1996-11-01), Krishna et al.
patent: 5573448 (1996-11-01), Nakazima et al.
patent: 5643406 (1997-07-01), Shimomura et al.
patent: 5709755 (1998-01-01), Kuno et al.
patent: 5791975 (1998-08-01), Cesna et al.
patent: 5814240 (1998-09-01), Yamashita
patent: 5849636 (1998-12-01), Harada et al.

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