Wafer alignment method

Details Wafer alignment method Wafer alignment method

2006-09-12

2006-09-12

Hoang, Quoc (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S975000, C438S508000, C257S797000

Reexamination Certificate

active

07105381

ABSTRACT:
The present invention relates to a wafer alignment method. The wafer alignment method includes the steps of forming first bonding pads and first wafer alignment marks of a convex shape on predetermined regions of a first semiconductor substrate in which a first device is formed, forming second bonding pads on predetermined regions of a second semiconductor substrate in which a second device is formed so that they correspond to the first bonding pads, and forming second wafer alignment marks of a hall shape on the predetermined regions of the second semiconductor substrate so that they correspond to the wafer alignment marks of the convex shape, disposing a rear surface of the second semiconductor substrate upwardly, so that the first bonding pads of the first semiconductor substrate and the second bonding pads of the second semiconductor substrate correspond to each other, polishing the rear surface of the second semiconductor substrate to form holes of the second wafer alignment marks through which X-rays to be projected later penetrate, aligning the first semiconductor substrate and the second semiconductor substrate so that the X-rays projected from the X-ray projector penetrate the second wafer alignment marks of the second semiconductor substrate and then reach the wafer alignment marks of the first semiconductor substrate through a X-ray sensing device, which has an X-ray projector and an X-ray detector and is adjacent to the rear surface of the second semiconductor substrate, and performing a thermal process on the first semiconductor substrate and the second semiconductor substrate, which are aligned, to electrically connect the first bonding pads and the second bonding pads.

REFERENCES:
patent: 6774477 (2004-08-01), Han

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