Wafer alignment and positioning apparatus for chip testing by vo

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

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324158R, G01R 3102

Patent

active

047728469

ABSTRACT:
An apparatus for use in testing IC chips on a semiconductor wafer is disclosed that allows the wafer and an electrical probe to be independently positioned and then clamped together and moved as a single unit when they are in alignment. This permits a chip on a wafer to be supplied with power and tested electronically while any desired area of the chip can be positioned in the field of view of a scanning electron microscope for examination, such as with a voltage-contrast secondary-electron detector. Use of the disclosed apparatus will greatly facilitate and simplify the testing of unbonded chips on semiconductor wafers.

REFERENCES:
patent: 4212075 (1980-07-01), Cleversey et al.
patent: 4593820 (1986-06-01), Antonie et al.

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