Wafer

Optical: systems and elements – Single channel simultaneously to or from plural channels – By partial reflection at beam splitting or combining surface

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

359629, 25055902, 25055904, 25055908, 250223R, G02B 2714

Patent

active

059495847

ABSTRACT:
An imaging system for viewing indicia on an object to be observed in which the indicia comprises a plurality of either hard and/or soft marks. The light supplied by a light source is collimated by at least one lens and supplied toward an object to be observed and the reflected light is then focussed at a focal plane. The focal plane is located adjacent or coincident with a light receiving entrance of a camera or other imaging device. When a soft mark is imaged, the light is supplied at an angle to but not along the optical axis and is focussed by the lens to from an accurate image of the light source at the focal plane. Any light which contacts the unaltered specular reflective surface of the object to be observed as well as the central area of the soft mark facilitates a true and accurate reflection of the light source at the focal plane while the altered, non-flat areas of the object to be observed at least partially scatter or disperse the supplied light. Some of the scattered and dispersed light is received by the light receiving entrance and can be focussed and observed by the camera so that the indicia can be accurately perceived by the camera using conventional techniques. When imaging a hard mark, light is supplied by the light source along the optical axis. The supplied light which illuminates the hard mark is effectively absorbed by or reflected away from the optical axis and thus appears dark while the specular areas of the object to be observed are perceived by the camera as being bright.

REFERENCES:
patent: 5005969 (1991-04-01), Kataoka
patent: 5713661 (1998-02-01), White

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1810025

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.