Wadded-wire LGA contact with parallel solid conductor

Details Wadded-wire LGA contact with parallel solid conductor Wadded-wire LGA contact with parallel solid conductor

2007-01-30

2007-01-30

Dinh, Phuong (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

11212007

ABSTRACT:
A connector, for example an LGA connector to be used in coupling a circuit board to a chip or a multi-chip module, includes an insulating carrier with a through-holes corresponding to the connections to be made above and below the carrier, and contacts in the through-holes. The contacts include wadded-wire wads that protrude above and below the carrier to make contact with the chip or circuit board, but each also includes a solid conductive member that extends over a major portion of the length of the through-hole and is in electro-mechanical connection with the wadded-wire wad or wads in the hole at numerous points along the length of the through-hole. The solid conductive member includes barbs or projections that penetrate the wadded wire. The solid conductive members thus provide a low-resistance parallel path and can also hold the wadded-wire wad or wads in place. A method of making and system are also disclosed.

REFERENCES:
patent: 4209481 (1980-06-01), Kashiro et al.
patent: 4992053 (1991-02-01), Lindeman et al.
patent: 5701233 (1997-12-01), Carson et al.
patent: 6094115 (2000-07-01), Nguyen et al.
patent: 6471525 (2002-10-01), Fan et al.
patent: 7029289 (2006-04-01), Li

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