Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-03-01
2005-03-01
Cuneo, Kamand (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S764000, C174S050510
Reexamination Certificate
active
06862191
ABSTRACT:
A miniaturized microelectronic, hybrid circuit package having either a single or a multi-layer, flexible, printed circuit substrate with printed conductors interconnecting a plurality of integrated circuit (IC) dies with a ball grid array (BGA) of contacts. The IC dies are arranged on parallel strips defined between preferential fold zones formed in the substrate. The dies are over molded with plastic that is shaped to facilitate the substrate being folded to form a polyhedron. When so folded, the over molded IC dies face inward and BGA is exposed on an outwardly facing surface to facilitate attachment of the folded package to a motherboard.
REFERENCES:
patent: 5224023 (1993-06-01), Smith et al.
patent: 5448511 (1995-09-01), Paurus et al.
patent: 6699730 (2004-03-01), Kim et al.
patent: 6753616 (2004-06-01), Coyle
Anderson Ronald L.
Hansen John E.
Kjear Melburn
Youker Nick
Cardiac Pacemakers Inc.
Cuneo Kamand
Dinh Tuan
Nikolai Thomas J.
Nikolai & Mersereau , P.A.
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