Radiation imagery chemistry: process – composition – or product th – Electric or magnetic imagery – e.g. – xerography,... – Post imaging process – finishing – or perfecting composition...
Patent
1999-05-11
2000-04-11
Picardat, Kevin M.
Radiation imagery chemistry: process, composition, or product th
Electric or magnetic imagery, e.g., xerography,...
Post imaging process, finishing, or perfecting composition...
438119, 438127, 257787, 257795, H01L 2144, H01L 2148, H01L 2328
Patent
active
060486562
ABSTRACT:
A vacuum source creates uniform flow of underfill material in the interstices between a semiconductor device and a substrate. A semiconductor device is attached to a substrate and a plurality of dams surround the semiconductor device. The dams have at least a first opening to allow underfill material to be injected into the space between the semiconductor device and the substrate. A vacuum cup is placed over a second opening and a vacuum source is applied to draw the underfill material throughout the interstices. Because the vacuum source is drawing the underfill material in a uniform manner, the underfill material fills the space without creating voids. If desired, multiple vacuum sources and multiple injection sites may be used. The underfill material may also be inserted from an aperture in the substrate located beneath the semiconductor device.
REFERENCES:
patent: 5203076 (1993-04-01), Banerji et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5385869 (1995-01-01), Liu et al.
patent: 5451721 (1995-09-01), Isukada et al.
patent: 5647123 (1997-07-01), Greenwood et al.
patent: 5677246 (1997-10-01), Maeta et al.
patent: 5681757 (1997-10-01), Hayes et al.
patent: 5697148 (1997-12-01), Lance, Jr. et al.
patent: 5710071 (1998-01-01), Beddingfield et al.
patent: 5766982 (1998-06-01), Akram et al.
patent: 5789278 (1998-08-01), Akram et al.
patent: 5801452 (1998-09-01), Farnworth et al.
patent: 5811879 (1998-09-01), Akram
patent: 5817545 (1998-10-01), Wang et al.
patent: 5834339 (1998-11-01), Distefano et al.
patent: 5834340 (1998-11-01), Sawai et al.
patent: 5835355 (1998-11-01), Dordi
patent: 5844319 (1998-12-01), Gamota et al.
patent: 5866442 (1999-02-01), Brand
patent: 5866953 (1999-02-01), Akram et al.
patent: 5919329 (1999-07-01), Banks et al.
Akram Salman
Jiang Tongbi
Micro)n Technology, Inc.
Picardat Kevin M.
LandOfFree
Void-free underfill of surface mounted chips does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Void-free underfill of surface mounted chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Void-free underfill of surface mounted chips will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1175189