Voice coil assembly

Details Voice coil assembly Voice coil assembly

1998-03-19

2000-10-10

Nguyen, Duc

Electrical audio signal processing systems and devices

Electro-acoustic audio transducer

Electromagnetic

381400, 381409, H04R 2500

Patent

active

061309559

ABSTRACT:
Voice coil assemblies are designed so that the solder points which connect the coil wires and the stranded wires, are connected via a separate adhesive seam to the diaphragm or the voice coil carrier. According to the invention, the solder points are placed in the adhesive seam by which the centering membrane is connected to the voice coil carrier. The first region of the centering membrane is designed to be open in the direction of the voice coil. By locating the solder points in the adhesive seam a voice coil assembly is created which is distinguished by a low design height, a good current-carrying capacity and an excellent height reproduction.

REFERENCES:
patent: 2164374 (1939-07-01), Barker
patent: 5014323 (1991-05-01), Markow et al.
patent: 5249236 (1993-09-01), Sakamoto
patent: 5641910 (1997-06-01), Middleton
Patent Abstracts of Japan and Japanese Patent Application J-288894, Sony Corp., Oct. 31, 1995.

Affiliated with

Also associated with

Rating

Voice coil assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Voice coil assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Voice coil assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2262470