Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-05-12
2000-08-15
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361707, 361709, 361713, 361715, 361719, 361720, 361784, 361785, 361788, 174 163, 174252, 165185, H05K 720
Patent
active
061046132
ABSTRACT:
A dual-board host or main printed wiring structure of a circuit module with increased component mounting area is made plug-compatible with a VME or VME64X backplane to which single-board host or main boards may be attached with connectors of differing dimensions and pin configurations, the center line of which are offset from each other. The connection sides of the two boards are respectively bonded to a heat sink frame structure having a thickness which corresponds to the connector offset on the backplane such that the total thickness of one of the printed wiring boards, the heat sink frame and the two bonding layers with respect to board to connector center line distances equals the connector offset at the backplane.
REFERENCES:
patent: 4107760 (1978-08-01), Zimmer
patent: 4730238 (1988-03-01), Cook
patent: 4808115 (1989-02-01), Norton et al.
patent: 4879634 (1989-11-01), Storrow et al.
patent: 4887353 (1989-12-01), Preputnick
patent: 4914259 (1990-04-01), Kobayashi et al.
patent: 4916575 (1990-04-01), Van Asten
patent: 4998180 (1991-03-01), McAuliffe et al.
patent: 5055069 (1991-10-01), Townsend et al.
patent: 5060113 (1991-10-01), Jacobs
patent: 5214570 (1993-05-01), Shah et al.
patent: 5218516 (1993-06-01), Collins et al.
patent: 5297025 (1994-03-01), Shoquist et al.
patent: 5396401 (1995-03-01), Nemoz
patent: 5482109 (1996-01-01), Kunkel
patent: 5483420 (1996-01-01), Schiavini
patent: 5502618 (1996-03-01), Chiou
patent: 5563769 (1996-10-01), MacGregor
patent: 5687064 (1997-11-01), Nichols
patent: 5710693 (1998-01-01), Tsukada et al.
patent: 5742479 (1998-04-01), Asakura
patent: 5812374 (1998-09-01), Shuff
Butler Jeffrey T.
Kane Christopher J.
Urda Eugene J.
Chervinsky Boris L.
Lockheed Martin Federal Systems, Inc.
Picard Leo P.
LandOfFree
VME eurocard double printed wiring card host circuit card circui does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with VME eurocard double printed wiring card host circuit card circui, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and VME eurocard double printed wiring card host circuit card circui will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2014203