VLSI-photonic heterogeneous integration by wafer bonding

Details VLSI-photonic heterogeneous integration by wafer bonding VLSI-photonic heterogeneous integration by wafer bonding

2007-04-10

2007-04-10

Rojas, Omar (Department: 2874)

Optical waveguides

Integrated optical circuit

C385S051000, C385S091000, C438S107000

Reexamination Certificate

active

10822201

ABSTRACT:
A new method to form a VLSI-photonic heterogeneous system device is achieved. The method comprises providing an optical substrate comprising at least one passive optical component formed therein. An electronic substrate is provided comprising at least one active electronic component formed therein. A plurality of metal pillars are formed through the optical substrate and protruding out a first surface of the optical substrate. A plurality of metal pads are formed on a first surface of the electronic substrate. The optical substrate and the electronic substrate are bonding together by a method further comprising aligning the first surfaces of the optical and electronic substrates such that the protruding metal pillars contact the metal pads. The optical and electronic substrates are then thermally treated such that the metal pillars bond to the metal pads.

REFERENCES:
patent: 6020624 (2000-02-01), Wood et al.
patent: 6455398 (2002-09-01), Fonstad, Jr. et al.
patent: 6456767 (2002-09-01), Terashima
patent: 6741778 (2004-05-01), Chan et al.
patent: 6935792 (2005-08-01), Saia et al.
patent: 6984544 (2006-01-01), Cloud et al.
patent: 2002/0076130 (2002-06-01), Pandraud
patent: 2002/0171077 (2002-11-01), Chu et al.
patent: 2003/0002809 (2003-01-01), Jian
patent: 2003/0091264 (2003-05-01), Kimerling
patent: 2003/0140317 (2003-07-01), Brewer et al.
patent: WO 02/48765 (2002-06-01), None
Kitigawa et al., “Hybrid Integration Technologies Using Planar Lightwave Circuits and Developed Components”, IEICE Trans. Electron, vol. E85-C, No. 4, Apr. 2002, pp. 1009-1017.
Worhoff et al., “Design, Tolerance Analysis, and Fabrication of Silicon Oxynitride Based Planar Optical Waveguides for Communication Devices”, Jrnl. of Lightwave Tech., vol. 17, No. 8, Aug. 1999, pp. 1401-1407.
Akahori et al., “Assembly and Wiring Technologies on PLC Platforms for Low-Cost and High-Speed Applications”, Proceedings of ECTC, 1997, pp. 632-637.
Rich et al., “Monolithically Integrated SiGe-Si PIN-HBT Front-End Photoreceivers,” IEEE Photonics Tech. Letters, vol. 10, No. 3, Mar. 1998, pp. 415-417.
Bio-Otp Electronic Sensor Systems (BOSS) Center, DARPA Optoelectronics Research Center, published on web site: www.micro.uiuc.edu/boss/TaskII.html, “Task II: Development of an Integrated Guided-Wave Interferometer-based Bio-Sensor System”, no date.

Affiliated with

Also associated with

Rating

VLSI-photonic heterogeneous integration by wafer bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with VLSI-photonic heterogeneous integration by wafer bonding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and VLSI-photonic heterogeneous integration by wafer bonding will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3763669