VLSI Packaging system

Details VLSI Packaging system VLSI Packaging system

1980-10-06

1983-08-02

Davie, James W.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

174 52R, 357 80, 357 81, H01L 2302, H01L 2342

Patent

active

043969356

ABSTRACT:
The present invention relates to an integrated circuit package for flat circuit elements such as an integrated circuit chip and an electrical connector for receiving such integrated circuit package. The integrated circuit package comprises a round ceramic carrier or substrate upon which an integrated circuit chip is mounted. The electrical connector of the present invention is a cylindrically shaped hollow socket, the inside diameter of the socket being large enough such that the ceramic substrate may be placed in the hollow. The inside cylindrical wall contains resilient pin-like connections arranged in a circle therein for making contact with a corresponding conductor of the integrated circuit package. The outside surface of the cylindrically shaped electrical connector is threaded for receiving a cap which holds the integrated circuit package against the resilient pin-like connections.

REFERENCES:
patent: 3491271 (1970-01-01), Weaver et al.
patent: 3700788 (1972-10-01), Spurek
patent: 4345267 (1982-08-01), Corman et al.

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