VLSI coaxial wiring structure

Details VLSI coaxial wiring structure VLSI coaxial wiring structure

1987-04-27

1988-10-11

Gensler, Paul

Metal working

Method of mechanical manufacture

Electrical device making

29600, 333243, 427 96, 427123, 4271261, 4271263, 4271264, H01B 1320

Patent

active

047760877

ABSTRACT:
A coaxial wiring structure that is constructed by depositing and etching a series of conductor layers and insulator layers. More specifically, the shielded transmission line of the invention comprises a first plate structure disposed on a first insulator layer disposed on a substrate; a second insulator layer disposed on the first insulator layer and the first plate structure, the second insulator layer having first troughs exposing end portions of the first plate structure; a central conductor and at least two peripheral conductors disposed on the second insulator layer, the two peripheral conductors contacting the end portions of the first plate structure through the first troughs; a third insulator layer disposed on the second insulator layer, the two peripheral conductors, and the central conductor, the third insulator layer having second troughs exposing respective ones of the peripheral conductors; and an upper plate structure formed on the third insulator layer, the upper plate structure contacting the peripheral conductors through the second troughs. In combination, the upper plate structure, the peripheral conductor structures and the lower plate structure surround the central conductor and are insulated therefrom by the respective insulator layers. The surrounding conductors are coupled to ground potential, and high frequency transmission signals are propagated along the central conductor.

REFERENCES:
patent: 3351816 (1967-11-01), Sear et al.
patent: 3370184 (1968-02-01), Zuleeg
patent: 3560893 (1971-02-01), Wen
patent: 3904997 (1975-09-01), Stinehelfer, Sr.
patent: 4379307 (1983-04-01), Soclof
patent: 4389429 (1983-06-01), Soclof
patent: 4575700 (1986-03-01), Dalman
patent: 4581291 (1986-04-01), Bongianni
patent: 4673904 (1987-06-01), Landis
Chalman et al., Multiple Function of Blind Copper Vias in Polyimide Multi-Layer Structure, 4th Annual Int'l. Electronics Packaging Confer., Oct.'84.

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