VLSI-chips package with floatingly mounted chip means

Details VLSI-chips package with floatingly mounted chip means VLSI-chips package with floatingly mounted chip means

1992-02-28

1995-04-11

Vo, Peter Dungba

Electricity: conductors and insulators

With fluids or vacuum

Boxes and housings

174 522, 29832, H05K 506

Patent

active

054060257

ABSTRACT:
The invention relates to a package for VLSI-chips. A substrate means (A1;B1;C1), a frame means (3;14) and a lid means (A5;B5;C5) makes a housing having an inside cavity. First connection means (4;16) are provided on the inside of said cavity in electrical contact with external contact means (6;22) on the outside of the housing. A chip (A3;B3;C3) having second connection means (8;B19) is placed inside the cavity. At least one interconnection film (A2;B2;C2) is placed adjacent the chip (A3;B3;C3) and has third and fourth connection means (9,5;21,20). The third connection means (9;21) are positioned to make contact with the second connection means (8;B19) on the chip. The fourth connection means (5;20) are positioned to make contact with the first connection means (4;16) inside the cavity. Individual ohmic contacts are provided individually between chosen among the third and fourth connection means (9, 5;21,20) for making connection between chosen of the first and second connection means (4,8;16,22).

REFERENCES:
patent: 4546411 (1985-10-01), Kaufman
patent: 4710798 (1987-12-01), Marcantonio
patent: 4758927 (1988-07-01), Berg
patent: 4835847 (1989-06-01), Kamperman
patent: 4855868 (1989-08-01), Harding
patent: 4941255 (1990-07-01), Bull
patent: 4974317 (1991-12-01), Rodriguez, II et al.
"Thin Film Module" IBM Technical Disclosure Bulletin, vol. 31, No. 8, Jan. 1989, pp. 135-138.

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