Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask
Reexamination Certificate
2005-07-28
2009-10-27
Huff, Mark F (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Radiation modifying product or process of making
Radiation mask
C378S034000, C378S035000
Reexamination Certificate
active
07608367
ABSTRACT:
The present invention is directed to the use of vitreous carbon as a substrate material for providing masks for X-ray lithography. The new substrate also enables a small thickness of the mask absorber used to pattern the resist, and this enables improved mask accuracy. An alternative embodiment comprised the use of vitreous carbon as a LIGA substrate wherein the VC wafer blank is etched in a reactive ion plasma after which an X-ray resist is bonded. This surface treatment provides a surface enabling good adhesion of the X-ray photoresist and subsequent nucleation and adhesion of the electrodeposited metal for LIGA mold-making while the VC substrate practically eliminates secondary radiation effects that lead to delamination of the X-ray resist form the substrate, the loss of isolated resist features, and the formation of a resist layer adjacent to the substrate that is insoluble in the developer.
REFERENCES:
patent: 4328298 (1982-05-01), Nester
patent: 4935320 (1990-06-01), Rohde et al.
patent: 5190637 (1993-03-01), Guckel et al.
patent: 5378583 (1995-01-01), Guckel et al.
patent: 5422921 (1995-06-01), Chiba
patent: 5527646 (1996-06-01), Ogino et al.
patent: 6103033 (2000-08-01), Say et al.
patent: 6482553 (2002-11-01), Gottert et al.
W. Becker, W. Ehrfeld, P. Hagmann, A. Maner, D. Munchmeyer, “Fabrication of Microstructures with High Aspect Ratios and Great Structural Heights by Synchrotron Radiation Lithography, Galvanoforming and Plastic Moulding (LIGA Process),”Microelectronic Engineering, 1986, v.4: 35-56.
W.K. Schomburg, H.J. Baying, and P. Bley, “Ti- and Be-X-Ray Masks with Alignment Windows for the LIGA Process”Microelectronic Engineering, 1991, v.13: 323-326.
F. J. Pantenburg, J Chlebeck, A. El-Kholi, H. L. Huber, J. Mohr, H. K. Oertel, J. Schultz, “Adhesion Problems in Deep-Etch X-ray Lithography Caused by Fluorescence Radiation from the Plating Base,”Microelectronic Engineering, 1994, v.23: 223-226.
Y. Vladimirsky, O. Vladimirsky, V. Saile, K.J. Morris, and J.M. Klopf “transfer mask for high aspect ratio micro-lithography,” inElectron-Beam, X-Ray, EUV, and Ion-Beam Submicrometer Lithographies for Manufacturing V, J.M. Warlaumont, (Ed.)Proceedings of SPIE,, 1995. v.2437: 391-396.
A. Schmidt, A. Clifton, W. Ehrfeld, G. Feiertag, H. Lehr and M. Schmidt, “Investigation of the Adhesive Strength of PMMA Structures on Substrates Obtained by Deep X-Ray Lithography,”Microelectronic Engineering, 1996, v.30: 215-218.
F. J. Pantenburg, S. Achenbach and J. Mohr, “Characterization of Defects in Very High Deep-Etch X-Ray Lithography Microstructues,”Microsystem Technologies1998, v.4: 89-93.
P. Coane, R. Giasoll, S. Ledger, K. Lian, Z. Ling, J. Gottert, “Fabrication of HARM structures by deep-X-ray lithography using graphite mask technology,”Microsystem Technologies, 1998, v.3: 94-98.
Y.M. Desta, G. Aigeldinger, K.J. Zanca, P. Coane, J. Gottert, and M.C. Murphy, “Fabrication of Graphite Masks for Deep and Ultra-deep X-ray Lithography,” InMaterials and Device Characterization in Micromachining III, Y. Vladimirsky, and P.J. Coane, (Eds.),Proceedings of SPIE,, 2000, v.4175: 122-130.
Th. Kunz, J. Mohr, A. Ruzzu, K. D. Skrobanek and U. Wallrabe, “Adhesion of Ni Structures on AL2O3Ceramic Substrates used for the Sacrificial Layer Technique,”Microsystem Technologies, 2000, v.6: 121-125.
A. El-Kholi, K. Bade, J. Mohr, F. J. Pantenburg and X. M. Tang, “Alternate Resist Adhesion and Electroplating Layers for LIGA Process,”Microsystem Technologies, 2000, v.6: 161-164.
K.E. Mayerhofer, E. Neubauer, C. Eisenmenger-Sittner, H. Hutter, “Adhesion promotion of Cu on C by Cr intermediate layers investigated by the SIMS method,”Analytical and Bioanalytical Chemistry, 2002, v.374: 602-607.
O. V. Makarova, D. C. Mancini, N. Moldovan, R. Divan, C. M. Tang, D. G. Ryding and R. H. Lee, “Microfabrication of Freestanding Metal Structures using Graphite Substrate,”Sensors and Actuators A, 2003, v.103: 182-186.
H.-U. Scheunemann, B. Loechel, L. Jian, D. Schondelmaier,Y.M. Desta, and J. Goettert, “Cost Effective Masks for Deep X-ray Lithography,” inSmart Sensors, Actuators and MEMS, J.-C.Chiao, V.K. Varadan, and C. Caný, (Eds.)Proceedings of SPIE, , 2003. v.5116:775-781.
M. Kuhnke, Th. Lippert, E. Ortelli, G.G. Scherer, and A. Wokaun, “Microstructuring Of glassy carbon: comparison of laser machining and reactive ion etching,”Thin Solid Films, 2004 v.453-454: 36-41.
Y. M. Desta, “Fabrication of High Aspect Ratio Vibrating Cylinder Microgyroscope Structures by Use of the LIGA Process”, Dissertation, LSU, Dec. 2005, pp. 1-179.
Aigeldinger Georg
Griffiths Stewart K.
Losey Matthew W.
Skala Dawn M.
Talin Albert Alec
Evans Timothy P.
Fraser Stewart A
Huff Mark F
Sandia Corporation
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