Visually inspectable surface mount device pad

Details Visually inspectable surface mount device pad Visually inspectable surface mount device pad

2005-08-31

2009-11-03

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C029S852000

Reexamination Certificate

active

07612296

ABSTRACT:
A printed circuit board having one or more vias disposed in the surface area of a pad. The pad may serve as a connection point between the printed circuit board and another circuit board and is disposed along the edge of the board such that the vias do not form half vias.

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Intel, “Introduction,” 1999 Packaging Databook, pp. 1-1 through 1-12.
Intel, “Leaded Surface Mount Technology”, 2000 Packaging Databook, pp. 7-1 through 7-14.
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Vern Solberg, Penwell Corp. Surface Mount Technology (SMT) Surface Mount Design Feb. 2003 pp. 1-3.

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