Metal fusion bonding – Process – With condition responsive – program – or timing control
Reexamination Certificate
2008-11-20
2010-10-12
Stoner, Kiley (Department: 1793)
Metal fusion bonding
Process
With condition responsive, program, or timing control
C228S008000, C228S105000
Reexamination Certificate
active
07810698
ABSTRACT:
An apparatus for correcting a positional offset of a bonding tool during bonding operations comprises a first fiducial mark and a second fiducial mark spaced from the first fiducial mark located on the bonding tool. A first imaging path emanates from the first fiducial mark and a second imaging path emanates from the second fiducial mark when the first and second fiducial marks are illuminated at a reference position. An optical system is positioned along the first and second imaging paths to view images of the first and second fiducial marks. A processor is operative to calculate a current position of the bonding tool and to compare it to a desired position so that the bonding tool's positional offset may be corrected by moving it to the desired position.
REFERENCES:
patent: 5909837 (1999-06-01), Safabakhsh et al.
patent: 5934543 (1999-08-01), Koduri
patent: 6006977 (1999-12-01), Koduri
patent: 6206266 (2001-03-01), Takahashi et al.
patent: 6337489 (2002-01-01), Matsumoto et al.
patent: 6555401 (2003-04-01), Koduri
patent: 7044182 (2006-05-01), Haraguchi
patent: 7591408 (2009-09-01), Walther
patent: 7644852 (2010-01-01), Nishiura et al.
patent: 2001/0016062 (2001-08-01), Enokido et al.
patent: 2001/0016786 (2001-08-01), Takahashi et al.
patent: 2001/0042770 (2001-11-01), Hayata et al.
patent: 2002/0008131 (2002-01-01), Hess et al.
patent: 2002/0039437 (2002-04-01), Sugawara
patent: 2002/0104870 (2002-08-01), Nogawa
patent: 2003/0012698 (2003-01-01), Hirota et al.
patent: 2003/0030821 (2003-02-01), Hayata et al.
patent: 2003/0098426 (2003-05-01), Hayata
patent: 2003/0123866 (2003-07-01), Hayata
patent: 2004/0060663 (2004-04-01), Haraguchi
patent: 2004/0129364 (2004-07-01), Onitsuka
patent: 2004/0188026 (2004-09-01), Kakutani
patent: 2004/0188642 (2004-09-01), Kodama et al.
patent: 2004/0261947 (2004-12-01), Haraguchi
patent: 2005/0286060 (2005-12-01), Beatson et al.
patent: 2006/0157537 (2006-07-01), Walther
patent: 2006/0209910 (2006-09-01), Fukunaga
patent: 2007/0181651 (2007-08-01), Takahashi et al.
patent: 2008/0017293 (2008-01-01), Chung et al.
patent: 2008/0145519 (2008-06-01), Kiguchi et al.
patent: 2008/0151267 (2008-06-01), Yasuda et al.
patent: 2008/0239327 (2008-10-01), Bryll
patent: 2010/0059574 (2010-03-01), Arahata et al.
patent: 2010/0072262 (2010-03-01), Sugawara et al.
patent: 2010/0073653 (2010-03-01), Shibazaki
patent: 05347326 (1993-12-01), None
Chung Kwok Kee
Fung Ka Fai
Fung Shun Ming Kenneth
Leung Wing Hong
Mok Chi Leung Vincent
ASM Assembly Automation Ltd.
Ostrolenk Faber LLP
Stoner Kiley
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