Viscous electropolishing system

Details Viscous electropolishing system Viscous electropolishing system

2005-08-30

2005-08-30

Rose, Robert A. (Department: 3723)

Abrading

Abrading process

Combined abrading

C451S041000

Reexamination Certificate

active

06935933

ABSTRACT:
A method for planarizing a surface of an electrically conductive layer on a substrate, where the surface of the electrically conductive layer has relatively high features and relatively low features. A viscous material is applied to the surface of the electrically conductive layer, whereby at least the relatively low features are covered by the viscous material. The substrate is immersed in an electrically conductive solution. An electrical potential is applied between the electrically conductive layer and an electrode within the electrically conductive solution, whereby reaction kinetics favor erosion of the electrically conductive layer. The electrically conductive solution is agitated, thereby selectively uncovering the viscous material from at least features that are relatively high, and thereby preferentially planarizing at least the features that are relatively high.

REFERENCES:
patent: 2752305 (1956-06-01), Turner
patent: 4564425 (1986-01-01), Janousek et al.
patent: 6149830 (2000-11-01), Lin et al.
patent: 6306012 (2001-10-01), Sabde
patent: 6315883 (2001-11-01), Mayer et al.
patent: 6376952 (2002-04-01), Stenta
patent: 6756307 (2004-06-01), Kelly et al.
Wang et al.,Stress-free polishing advances copper integrated with ultralow-k dielectrics, Solid State Technology, pp. 101-106, Oct. 2001.

Affiliated with

Also associated with

Rating

Viscous electropolishing system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Viscous electropolishing system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Viscous electropolishing system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3445735