Viscous electroless plating solutions

Details Viscous electroless plating solutions Viscous electroless plating solutions

1991-07-01

1992-10-27

Bell, Mark L.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 122, 106 124, 106 126, 106 127, 106 128, 427437, 427438, 4274431, C23C 1834, C23C 1840

Patent

active

051586045

ABSTRACT:
Viscous aqueous electroless plating solutions comprising ionic depositable metal species such as copper or nickel, metal complexing agent such as EDTA, metal reducing agent such as formaldehyde or hypophosphite and thickener such as xantham gum, silica or carboxymethylcellulose have a viscosity greater than 50 cp, for instance up to 20,000 cp. The viscous solutions are useful for electrolessly depositing metal onto moving or inclined catalytic substrates and as a component of kits for applying electrolessly deposited metal images to such surfaces.

REFERENCES:
patent: 3329512 (1967-07-01), Shipley et al.
patent: 3617320 (1971-11-01), Lee
patent: 4048354 (1977-09-01), Feldstein
patent: 4099974 (1978-07-01), Morishita et al.
patent: 4220678 (1980-09-01), Feldstein
patent: 4224178 (1980-09-01), Feldstein
patent: 4253875 (1981-03-01), Heymann et al.
patent: 4265943 (1981-05-01), Goldstein et al.
patent: 4273804 (1981-05-01), Feldstein
patent: 4425378 (1984-01-01), Maher
patent: 4548644 (1985-10-01), Nakaso et al.
patent: 4581256 (1986-04-01), Sommer
patent: 4622069 (1986-11-01), Akai et al.
Dialog Abstract of JP75/014617.
STN (Chem. Ab)., CA83(26):211923e, Abstract of JP75/014617.

Affiliated with

Also associated with

Rating

Viscous electroless plating solutions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Viscous electroless plating solutions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Viscous electroless plating solutions will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-903399