Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Reexamination Certificate
2006-02-28
2006-02-28
Ortiz, Angela (Department: 1732)
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
C264S272170, C264S276000, C264S328500, C425S116000, C425S544000
Reexamination Certificate
active
07005101
ABSTRACT:
The mold for a thin package uses a gate which has a high aspect ratio, about 30 degrees or greater throughout the length of the gate. Additionally, the depth of the gate goes to zero at a point outside of the area of the finished package, but within the dam bars, so that the leadframe space acts as a virtual gate. This reduces the need for trimming and lowers stress on the finished package.
REFERENCES:
patent: 4126292 (1978-11-01), Saeki et al.
patent: 4252294 (1981-02-01), Uchio
patent: 4641418 (1987-02-01), Meddles
patent: 4741507 (1988-05-01), Baird
patent: 4954308 (1990-09-01), Yabe et al.
patent: 5196917 (1993-03-01), Ueda et al.
patent: 5386342 (1995-01-01), Rostoker
patent: 5429488 (1995-07-01), Neu
patent: 5472646 (1995-12-01), Uchida et al.
patent: 5624691 (1997-04-01), Bednarz et al.
patent: 5635220 (1997-06-01), Izumi et al.
patent: 5650177 (1997-07-01), Kojima et al.
patent: 5723126 (1998-03-01), Gargan et al.
patent: 5723156 (1998-03-01), Matumoto
patent: 5744083 (1998-04-01), Bednarz et al.
patent: 5750153 (1998-05-01), Shibata
patent: 5780078 (1998-07-01), Chen
patent: 5891384 (1999-04-01), Miyajima
patent: 6015280 (2000-01-01), Blish et al.
patent: 6056536 (2000-05-01), Schad et al.
patent: 6319450 (2001-11-01), Chua et al.
patent: 6428731 (2002-08-01), Bernardus Peters et al.
“Gate Design”, Dupont , Surlyn Part and Mold Design Guide, Part 4, Downloaded from Internet at http://www.dupont.com/industrial-polymers—/surlyn/E-37240-2/part4.html, May 30, 2000, 3 pages.
“Machine Nozzle”, Dupont, Surlyn Part and Mold Design Guide: Part 3, Downloaded from Internet at http://www.dupont.com/industrial-polymers/surlyn/E-37240-2/part3.html, May 30, 2000, 3 pages.
“Unique Molding System Design Offers Superior Device Encapsulation”, 1998 ChipScale Review, Dr. Daniel Wong, et al., Downloaded from Internet at http://www.chipscalereview.com/issues/0398/wky1.htm, May 7, 2000, pp. 1-9.
“7.2.1 Gate Size”, Mold Design, Duracon™ Molding Tech., Polyplastics, Downloaded for Internet, May 30, 2000, Source unknown, pp. 1.
“Ryton® PPS Injection Molding Trouble Shooting Guide”, Ryton Polyphenylene Sulfide Resins, Downloaded from Internet, at http://www.ryton-pps.com/DataSheets/Trouble ShootingGuide.html, May 30, 2000, pp. 1-4.
“3.0 Device Construction”, Downloaded from Internet, http://epims.gsfc.nasa.gov/ctre/act/techdocs/pems/pem3.html, May 7, 2000, pp. 1-17.
“2.0 Definitions, pp. 1-9, 4.0 General Characteristics, pp. 1-3, 5.0 Reliability Considerations pp. 1-8”, Downloaded from Internet, http://misspiggy.gsfc.nasa.gov.ctre/act/techdocs/pems/pem2.htm, pem4.htm, pem5.htm, May 30, 2000.
Brady III Wade James
Ortiz Angela
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Tung Yingsheng
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