Vibratory wave soldering

Details Vibratory wave soldering Vibratory wave soldering

1986-02-19

1987-08-04

Godici, Nicholas P.

Metal fusion bonding

Process

Plural joints

228262, 228 37, B23K 3102

Patent

active

046840567

ABSTRACT:
Wave soldering process and apparatus for the soldering of elements such as, for example, printed circuit assemblies with surface mounted components and the like which yield improved soldering results by promoting the penetration of solder into narrow spaces between components, the filling of small holes in a board, filling crevices, filling corners adjacent to solder masks and all other areas where solder wetting is difficult to achieve with conventional machines. The process provides the steps of moving an element in a predetermined path, forming a solder wave beneath the path so that at least a portion of the element passes through the solder wave, and producing an oscillation in the solder wave during the passage of the element therethrough.

REFERENCES:
patent: 3140527 (1965-06-01), Tardoskegyi
patent: 3266136 (1966-08-01), Gutvier
patent: 3303983 (1967-02-01), Patrick et al.
patent: 3430332 (1969-03-01), Roczey-Koller
patent: 3605244 (1971-09-01), Osborne et al.
patent: 3921888 (1975-11-01), Elliott et al.
patent: 3989180 (1976-11-01), Tardoskegyi
patent: 4465219 (1984-08-01), Kondo
patent: 4540114 (1985-09-01), Pachschwoll

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