Vibration-free tailless wire bonder

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder

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Details

H01L 2160

Patent

active

042341175

ABSTRACT:
An improved tailless wire-bonding apparatus for wedge-bonding fine wire used in the manufacture of semiconductor devices including adjustable linear actuating devices, such as solenoids, energized in the proper sequence by a solid state logic circuit, which operate as latching and releasing mechanisms to control the motion of the bonding arm and wire clamp, and a Z-drive to search heights which may be preset and/or adjusted manually with each bond. A viscous hydraulic fluid damping system serves as a velocity limiting device to maintain the bonding arm at a predetermined maximum downward velocity as it drops toward the workpiece, and to eliminate, after impact, all significant vibration between the bonding tool and the fine wire prior to the application of bonding energy. After the termination bond is made and while the bonding tool is still on the fine wire on the workpiece, the wire clamp, grasping the wire in its compliant, non-deforming jaws, moves upward and away from the bond pulling the wire taut until it separates at the heel of the bond leaving no tail. During this maneuver, the bonding tool remains on the bond until the tail has been removed, then lifts and accepts the free end of the wire being fed by the clamp to be ready for the next bonding cycle.

REFERENCES:
patent: 3307763 (1967-03-01), Rasimenoks et al.
patent: 3328875 (1967-07-01), Pennings
patent: 3444612 (1969-05-01), Pennings
patent: 3626590 (1971-12-01), Miller
patent: 3643321 (1972-02-01), Field et al.
patent: 3660631 (1972-05-01), Conley
patent: 3863827 (1975-02-01), Foulke et al.

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