Supports – Resilient support – Including additional energy absorbing means – e.g. – fluid or...
Reexamination Certificate
1999-03-11
2001-04-10
King, Anita M. (Department: 3632)
Supports
Resilient support
Including additional energy absorbing means, e.g., fluid or...
C052S167800, C248S679000
Reexamination Certificate
active
06213444
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates in general to a vibration damper, and more particularly to a vibration damper on which a scanner can be mounted.
2. Description of the Related Art
New methods for achieving high resolution of photolithography are continually developed to manufacture devices with higher precision, as semiconductor are increasingly integrated. In the future, scanners are expected to become mainstream technology because of the requirements of 0.18 &mgr;m size devices. Therefore, the dampening ability of the vibration damper has to increase as well. The required vibration damper prevents floor vibrations from disturbing the scanner and avoids the force produced by the scanner, which the scanner can't disperse and which may affected the next exposure step of the scanner.
Semiconductor manufactory floors are metal grids or have holes in them to to facilitate the connections of several kinds of culverts in the manufactories. Therefore, these floors are less dense than solid, flat floors. When a scanner is mounted on such a floor, it is necessary that the vibration damper be light, since the scanner itself already weighs about 7200 kg.
The conventional vibration damper is a steel baseplate with a simple structure that has a poor damping ability. Therefore, the conventional vibration damper is only suitable for processes with low precision requirements and is not suitable for devices with sizes less than 0.1 &mgr;m because of its poor damping ability. The improved vibration damper is composed of ferroconcrete so that the vibration-proof ability is improved. However, this type of vibration damper is at least 2000 kg heavier than the scanner, and the floors of the manufactories cannot bear that much weight. Therefore, the conventional vibration damper does not meet the actual requirements of the processes. A need exists for an improved damper.
SUMMARY OF THE INVENTION
The invention achieves the above-identified object by providing a vibration damper between a semiconductor manufacturing machine and a floor. The vibration damper has an 1-shaped girder structure and a material filling the space between the floor and I-shaped girder structure. A support element having two layers of latticed armatures is mounted on the I-shaped girder structure. The support element is filled with cement. A layer of vibration absorber is placed on the cement.
The total weight of the vibration damper does not exceed 3000kg due to the use of simple materials. The vibration damper of the invention has high vibration-proof ability.
REFERENCES:
patent: 2210051 (1940-08-01), Woodbury
patent: 2441509 (1948-05-01), Robinson
patent: 3190041 (1965-06-01), Kimball
patent: 3334850 (1967-08-01), Jackson et al.
patent: 3469809 (1969-09-01), Reznick et al.
patent: 4700923 (1987-10-01), Lewis, Jr. et al.
patent: 5054251 (1991-10-01), Kemeny
patent: 5277395 (1994-01-01), Smith et al.
King Anita M.
United Silicon Incorporated
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