Vibratable die attachment tool

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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Details

C156S073600, C156S580000, C156S583100

Reexamination Certificate

active

07147735

ABSTRACT:
A die attachment includes a placement head, a platen, and a vibration mechanism to vibrate at least a selected one of the placement head and platen while a die and a substrate mounted on the placement head and the platen, respectively, are in contact.

REFERENCES:
patent: 3388848 (1968-06-01), Youmans et al.
patent: 4145390 (1979-03-01), Zschimmer
patent: 5690766 (1997-11-01), Zwick
patent: 6321973 (2001-11-01), Minamitani et al.
patent: 6467670 (2002-10-01), Higashi et al.
patent: 6564988 (2003-05-01), Shiraishi et al.
patent: 6706130 (2004-03-01), Minamitani et al.
patent: 6778038 (2004-08-01), Takeishi et al.
patent: 2001/0051396 (2001-12-01), Iwahashi et al.
patent: 2002/0115278 (2002-08-01), Kawai
patent: 2003/0019561 (2003-01-01), Tominaga et al.
patent: 2003/0139004 (2003-07-01), Yoshida
patent: 2004/0047127 (2004-03-01), Yamauchi et al.

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