Vias and method for making the same in organic board and chip ca

Details Vias and method for making the same in organic board and chip ca Vias and method for making the same in organic board and chip ca

1997-11-14

1999-09-07

Sough, Hyung-Sub

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174264, 174265, 29852, 205125, 427 97, H05K 102, H05K 342

Patent

active

059490306

ABSTRACT:
Multiple vias are produced coaxially or in axis parallel alignment in a first or primary through-hole in a printed circuit board, chip carrier or like electrical device by producing a primary metallized through hole or via which is then filled or coated with a dielectric material which is also placed on both surfaces of the device at the ends of the via. The dielectric material inside the via can then be provided with at least one coaxial through-hole or multiple axis parallel through holes which can be metallized to form conductive paths between the surfaces of the device. Portions of the dielectric surface layer can be removed to expose contacts to the inner metallized via. Successive coaxial vias can be made in any number by the method of the invention. In addition electrical signal paths can be isolated within voltage or ground co-axial conductors.

REFERENCES:
patent: 4911796 (1990-03-01), Reed
patent: 5300911 (1994-04-01), Walters
patent: 5374788 (1994-12-01), Endoh et al.
patent: 5421083 (1995-06-01), Suppelsa et al.
patent: 5541567 (1996-07-01), Fogel et al.
patent: 5653834 (1997-08-01), Azzaro et al.
patent: 5689091 (1997-11-01), Hamzehdoost et al.

Affiliated with

Also associated with

Rating

Vias and method for making the same in organic board and chip ca does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Vias and method for making the same in organic board and chip ca, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Vias and method for making the same in organic board and chip ca will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1806384