Vias and contact plugs with an aspect ratio lower than the aspec

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257752, 257763, 257751, H01L 2348

Patent

active

058567070

ABSTRACT:
A method of forming vias in an interlevel dielectric structure of an integrated circuit, such that the aspect ratio of the vias is smaller than the aspect ratios of vias having a height equal to the thickness of the entire interlevel dielectric structure, and the integrated circuit formed according to such a method. Conductive elements are formed over an insulator. A first dielectric structure is formed over the conductive elements and over the insulator. The first dielectric structure contains a first dielectric, formed over the conductive elements and the insulator, and a planarizing dielectric, formed over the first dielectric to bulk fill the areas between the conductors. A thin layer of a second dielectric can be formed over the first dielectric and the planarization dielectric. Vias are patterned and etched in the first dielectric structure. The thickness of the first dielectric structure is such that the aspect ratios of the vias through it is close to, or less than, 1. A thin barrier is formed in the vias, and the vias are filled with contact plugs. A second dielectric structure is then formed over the first dielectric structure and the contact plugs. Vias are patterned and etched in this second dielectric structure. The thickness of the second dielectric structure is also such that the aspect ratios of the vias through it is close to, or less than, 1. A thin barrier is formed in the vias, and the vias are filled with contact plugs. Additional dielectric structures containing vias and contact plugs may be formed over the second dielectric structure.

REFERENCES:
patent: 4541169 (1985-09-01), Bartush
patent: 4775550 (1988-10-01), Chu et al.
patent: 4826786 (1989-05-01), Merenda et al.
patent: 5063175 (1991-11-01), Broadbent
patent: 5069749 (1991-12-01), Gutierrez
patent: 5079188 (1992-01-01), Kawai
patent: 5202579 (1993-04-01), Fujii et al.
patent: 5304510 (1994-04-01), Suguro et al.
patent: 5354712 (1994-10-01), Ho et al.
patent: 5437763 (1995-08-01), Huang
patent: 5519239 (1996-05-01), Chu

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Vias and contact plugs with an aspect ratio lower than the aspec does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Vias and contact plugs with an aspect ratio lower than the aspec, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Vias and contact plugs with an aspect ratio lower than the aspec will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-865296

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.