Via stub termination structures and methods for making same

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S763000, C361S766000, C174S260000, C174S261000

Reexamination Certificate

active

07457132

ABSTRACT:
Vias are used in multilayer printed circuit boards to route electrical interconnects between layers. Some via constructions embodiments result in the formation of a via-stub section. Via stub sections can distort signals passing through the interconnect and decrease the usable bandwidth of the interconnect. To minimize distortion and increase bandwidth, one or more terminating elements can be attached to the unterminated end of the via-stub section. The impedance terminating element may include, by way of non-limiting example, one or more resistors, capacitors, and/or inductors between the via stub and a ground layer. The impedance terminating element may be formed internally to the PCB or mounted to the PCB surface.

REFERENCES:
patent: 5079069 (1992-01-01), Howard et al.
patent: 5155655 (1992-10-01), Howard et al.
patent: 5161086 (1992-11-01), Howard et al.
patent: 5162977 (1992-11-01), Paurus et al.
patent: 5347258 (1994-09-01), Howard et al.
patent: 5603847 (1997-02-01), Howard et al.
patent: 5708569 (1998-01-01), Howard et al.
patent: 6388208 (2002-05-01), Kiani et al.
patent: 6593535 (2003-07-01), Gailus
patent: 6927471 (2005-08-01), Salmon
patent: 7030712 (2006-04-01), Brunette et al.
patent: 2002/0047090 (2002-04-01), Sakurai et al.
patent: 2003/0116856 (2003-06-01), Tomsio et al.
patent: 2006/0007662 (2006-01-01), Vasudivan et al.
patent: 2006/0125573 (2006-06-01), Brunette et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Via stub termination structures and methods for making same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Via stub termination structures and methods for making same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Via stub termination structures and methods for making same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4044609

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.