Via structure of printed circuit board

Details Via structure of printed circuit board Via structure of printed circuit board

2007-10-30

2011-11-29

Dinh, Tuan T (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S265000, C174S266000

Reexamination Certificate

active

08067700

ABSTRACT:
A printed circuit board (200) includes at least one via (280) defined therein, the via has an upper cap (220) formed on a top surface of the PCB, and a lower cap (240) formed on a bottom surface of the PCB. A conductive hole (290) is defined in the PCB having a plated sidewall (230) plated on its inner surface, and a first clearance hole (271) is defined in a first inner layer (260) of the PCB around the sidewall. A first transmission line (210) defined on the top surface of the PCB is coupled to the upper cap, a first void (273) extending from a boundary of the first clearance hole being disposed along the layout direction of the first transmission line.

REFERENCES:
patent: 6329603 (2001-12-01), Japp et al.
patent: 6388206 (2002-05-01), Dove et al.
patent: 6767252 (2004-07-01), McGrath et al.
patent: 6787710 (2004-09-01), Uematsu et al.
patent: 7317166 (2008-01-01), Nakamura

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