Via-structure of a multilayer interconnection ceramic substrate

Details Via-structure of a multilayer interconnection ceramic substrate Via-structure of a multilayer interconnection ceramic substrate

1995-05-12

1996-11-19

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174265, 174262, H05K 102

Patent

active

055765181

ABSTRACT:
A via-structure off a multilayer interconnection ceramic substrate for a multi-chip module, a semiconductor package and an insulating substrate has a high strength and a high reliability being produced at a low cost. A gap is provided at an interface between a via-conductor and ceramics, and filled with a resin. The resin is preferably of a thermosetting polyimide resin or a benzo-cyclo-butene resin.

REFERENCES:
patent: 3873756 (1975-03-01), Gall et al.
patent: 4318954 (1982-03-01), Jensen
patent: 4715117 (1987-12-01), Enomoto
patent: 4740414 (1988-04-01), Shaheen

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