Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2007-01-10
2011-12-27
Norris, Jeremy (Department: 2835)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C361S794000
Reexamination Certificate
active
08084695
ABSTRACT:
The embodiment of the invention is about a novel via structure which can be incorporated into printed circuit boards, integrated circuit packages, and integrated circuits in order to reduce crosstalk, to improve signal integrity and to achieve EM emission compliance. A 4-layer (2 signal layers and 2 power layers or 2 signal layers and 2 ground layers) circuit board assembly was used for demonstrating the effect of the novel via structure. The same concept can be applied to any multi-layer circuit board. Layers that have an electrical property can be added above, under, or within the basic 4-layer circuit board to achieve a multi-layer circuit board. For 2-layer and 3-layer circuit boards, a deformed version of the proposed via structure based upon the same concept will be needed for a coplanar waveguide configuration.
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Hsu Hsiuan-ju
Ziolkowski Richard Walter
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