Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2007-09-18
2007-09-18
Dinh, Tuan T. (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S265000, C174S266000
Reexamination Certificate
active
10888064
ABSTRACT:
A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive material in a via within the clearance hole will not contact the conductive layer and create a short circuit. In one embodiment, the protective coating is sufficiently hard to deflect a drill bit being used to drill the via hole, thus protecting against misregistered drilled holes.
REFERENCES:
patent: 3739469 (1973-06-01), Dougherty, Jr.
patent: 3932932 (1976-01-01), Goodman
patent: 4170819 (1979-10-01), Peter et al.
patent: 4183137 (1980-01-01), Lomerson
patent: 5257452 (1993-11-01), Imai et al.
patent: 5317476 (1994-05-01), Wallace et al.
patent: 5374788 (1994-12-01), Endoh et al.
patent: 5421083 (1995-06-01), Suppelsa et al.
patent: 5587119 (1996-12-01), White
patent: 5779836 (1998-07-01), Kerrick
patent: 5863447 (1999-01-01), Coteus et al.
patent: 5949030 (1999-09-01), Fasano et al.
patent: 5959348 (1999-09-01), Chang et al.
patent: 5981880 (1999-11-01), Appelt et al.
patent: 6201194 (2001-03-01), Lauffer et al.
Dishongh Terrance J.
Jessep Rebecca A.
McCormick Carolyn R.
Morgan Thomas O.
Blakely , Sokoloff, Taylor & Zafman LLP
Dinh Tuan T.
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