Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,...
Reexamination Certificate
2007-01-30
2007-01-30
Duverne, J. F. (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Reexamination Certificate
active
11400217
ABSTRACT:
A via provides a plurality of electrical connections between conductors on different layers of a circuit board. The via includes an opening through the circuit board formed by a plurality of substantially partially overlapping bores. An electrically conductive plating is formed on an inner surface of the opening. The plating forms a plurality of distinct electrically conductive paths.
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IBM, Test Probe Contact Grid Translator Board, Jan. 1979, IBM Technical Disclose Bulletin, vol. 21, All.
Broadcom Corporation
Duverne J. F.
Sterne Kessler Goldstein & Fox PLLC
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