Via providing multiple electrically conductive paths

Details Via providing multiple electrically conductive paths Via providing multiple electrically conductive paths

2006-08-22

2006-08-22

Duverne, J. F. (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Reexamination Certificate

active

07094060

ABSTRACT:
A via provides a plurality of electrical connections between conductors on different layers of a circuit board. The via includes an opening through the circuit board formed by a plurality of substantially partially overlapping bores. An electrically conductive plating is formed on an inner surface of the opening. The plating forms a plurality of distinct electrically conductive paths.

REFERENCES:
patent: 6613986 (2003-09-01), Hirose et al.
patent: 6651322 (2003-11-01), Currie
patent: 6879234 (2005-04-01), Furumiya et al.
patent: 2002/0076903 (2002-06-01), Kondo et al.
patent: 2003/0102151 (2003-06-01), Hirose et al.
patent: 2003/0235115 (2003-12-01), Porzio
IBM, Test Probe Contact Grid Translator Board, Jan. 1979, IBM Technical Disclose Bulletin, vol. 21, All.
Geoff Smithson, “Practical RF Printed Circuit Board Design,” presented at the Institution of Electrical Engineers (IEE) Training Event “How to Circuits,” (location unknown) Apr. 5, 2000, 6 pages.

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