Via paste compositions and use thereof to form conductive vias i

Details Via paste compositions and use thereof to form conductive vias i Via paste compositions and use thereof to form conductive vias i

1991-03-20

1994-02-01

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428323, 428324, 428325, 428624, 428632, 428631, 428612, 428402, 428137, 428403, B32B 900

Patent

active

052831043

ABSTRACT:
Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

REFERENCES:
patent: Re32107 (1986-04-01), January
patent: 824124 (1859-11-01), Edward
patent: 2267571 (1941-12-01), McDougal
patent: 3508938 (1970-04-01), Jones
patent: 3624007 (1971-11-01), Meyer
patent: 3725091 (1973-04-01), Chyring et al.
patent: 3794518 (1974-02-01), Howell
patent: 3968056 (1976-07-01), Bolan et al.
patent: 4098949 (1978-07-01), Kosiorek
patent: 4301324 (1981-11-01), Kumar et al.
patent: 4419279 (1983-12-01), Abrams
patent: 4547625 (1985-10-01), Tosaki
patent: 4594181 (1986-06-01), Siuta
patent: 4598167 (1986-07-01), Ushifusa et al.
patent: 4599277 (1986-07-01), Brownlow et al.
patent: 4624865 (1986-11-01), Gindrup et al.
patent: 4723993 (1988-02-01), Kopatz et al.
patent: 4756746 (1988-07-01), Kemp et al.
patent: 4773928 (1988-09-01), Houck et al.
patent: 4778517 (1988-10-01), Kopatz et al.
patent: 4818607 (1989-04-01), Rickborn et al.
Malliaris et al., "Influence of Particle Size on the Electrical Resistivity . . . ", Journal of Applied Physics, vol. 42, No. 2, Feb. 1971, pp. 614-618.
Elliot, "Phase Relationships in the Pyrometallurgy of Copper", Metallurgical Transaction B, vol. 7B, Mar. 1976, pp. 17-33.
Kusy, "Influence of Particle Size Ratio on the Continuity of Aggregates", J. Appl. Phys., 48(12) Dec. 1977, pp. 5301-5305.
Carcia et al., "Particle Size Effects in Thick Film Resistors", J. Appl. Phys. 53 (7) Jul. 1982, pp. 5282-5287.
Wittmer, "Eutectic Bonding of Copper to Ceramics", Mat. Res. Soc. Symp. Proc., vol. 40, 1985, pp. 393-398.
Giess et al., "Isothermal Sintering of Spheroidized Cordierite-Type Glass Powders," Amer. Cer. Soc. vol. 68, No. 12, Dec. 1985.

Affiliated with

Also associated with

Rating

Via paste compositions and use thereof to form conductive vias i does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Via paste compositions and use thereof to form conductive vias i, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Via paste compositions and use thereof to form conductive vias i will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-578621