Via pad geometry supporting uniform transmission line structures

Details Via pad geometry supporting uniform transmission line structures Via pad geometry supporting uniform transmission line structures

1997-10-28

2000-08-29

Sough, Hyung-Sub

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174261, 333 1, 361777, 361783, 439 61, H05K 114

Patent

active

061112054

ABSTRACT:
A connector for coupling high frequency signals between devices includes a substrate having an array of vias for coupling a reference voltage to reference voltage traces that extend along the substrate surface between the devices. Signal traces including device pads for coupling signals to and from the devices alternate with the reference voltage traces. The widths of the reference voltage traces are varied to maintain a substantially constant separation between the reference voltage trace and an adjacent signal trace.

REFERENCES:
patent: 3033914 (1962-05-01), Acosta-Lieras
patent: 3398232 (1968-08-01), Hoffman
patent: 5272600 (1993-12-01), Carey
patent: 5764489 (1998-06-01), Leigh et al.

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