Via-less connection using interconnect traces between bond pads

Details Via-less connection using interconnect traces between bond pads Via-less connection using interconnect traces between bond pads

1998-06-26

2000-09-26

Davis, David

Dynamic magnetic information storage or retrieval

Fluid bearing head support

Disk record

G11B 2120

Patent

active

061250147

ABSTRACT:
A planar air bearing slider assembly has an air bearing surface (ABS), a top surface opposite the ABS, and a trailing end. A thin film magnetic transducer is formed on the slider. The transducer has first and second spaced magnetic pole layers that define a magnetic yoke region. A coil structure having first and second ends is disposed between the pole layers for conducting data signals. First and second copper traces are routed from the first and second ends to the trailing end of the planar slider. First and second gold foil bonding pads located on the trailing end of the slider are attached to the copper traces with silver epoxy to provide an external connection to the coil.

REFERENCES:
patent: 5590005 (1996-12-01), Tachibana
patent: 5721651 (1998-02-01), Kitahara
patent: 5781377 (1998-07-01), Koka et al.
patent: 5786962 (1998-07-01), Kawazoe
patent: 5796549 (1998-08-01), Sedbrook et al.
patent: 5894380 (1999-04-01), Sasada et al.
patent: 5896248 (1999-04-01), Hanrahan et al.

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