Via hole punch

Details Via hole punch Via hole punch

1992-09-08

1994-04-19

Parker, Roscoe V.

Metal tools and implements, making

Blank or process

Die

76 4, B21K 520

Patent

active

053036182

ABSTRACT:
A punch die used to punch minute via holes in ceramic wafers used in integrated circuit construction is created by photoetching holes too small to be mechanically drilled into a pair of thin sheets that sandwich therebetween a thicker spacer slab having somewhat larger, mechanically drilled holes. A multiplicity of punch pins are then pressed into the three-layer sandwich and epoxied thereto to create an inexpensive a punch die which cooperates with a mechanically drilled die plate covered with a punch-pin receiving perforated skin, the holes in which being created in a similar photoetching process.

REFERENCES:
patent: 3228275 (1966-01-01), Taber
patent: 3477317 (1969-11-01), Liander
patent: 4292862 (1981-10-01), Thompson

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