Via hole forming method

Details Via hole forming method Via hole forming method

2011-04-05

2011-04-05

Evans, Geoffrey S (Department: 3742)

Electric heating

Metal heating

By arc

Reexamination Certificate

active

07919725

ABSTRACT:
A method of forming a via hole reaching a bonding pad in a wafer having a plurality of devices on the front surface of a substrate and bonding pads on each of the devices, by applying a laser beam from the rear surface side of the substrate, comprising the steps of forming an annular groove by applying a laser beam to an annular area surrounding a via hole forming area on the rear surface of the substrate; and forming a via hole reaching a bonding pad by applying a laser beam to the via hole forming area surrounded by the annular groove from the rear surface side of the substrate.

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patent: 2004/0112881 (2004-06-01), Bloemeke et al.
patent: 2007/0045254 (2007-03-01), Morikazu
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Machine translation of Japan Patent document No. 2000-2002,664, Apr. 2010.
Machine translation of Japan Patent document No. 2002-217,551, Apr. 2010.

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