Via heat sink material

Details Via heat sink material Via heat sink material

2006-10-24

2006-10-24

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S222000, C228S215000, C228S260000, C029S832000

Reexamination Certificate

active

07124931

ABSTRACT:
The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated.

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