Via formation method for multilayer interconnect board

Details Via formation method for multilayer interconnect board Via formation method for multilayer interconnect board

1989-09-15

1992-04-28

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 97, 427 531, C23C 2600

Patent

active

051087855

ABSTRACT:
A method of boring holes in a circuit board assembly of the type having a first layer of material which is primarily reflective of light of a first light wavelength and having a second layer of material, overlying the first layer of material, which is primarily absorptive of light of the first light wavelength, comprising: tuning the frequency of a laser cutting device to the first light wavelength; directing a laser beam from the tuned laser cutting device onto the second layer of material in a region where a hole is to be provided; and terminating application of the laser beam after a hole has been bored through the second layer of material.

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