Via filling of green ceramic tape

Details Via filling of green ceramic tape Via filling of green ceramic tape

1988-03-23

1989-02-07

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 89, 156249, 156252, 156253, 427 97, B32B 3118

Patent

active

048029459

ABSTRACT:
A process is disclosed for filling vias in a sheet of dielectric tape for use in fabricating hybrid multilayer circuit structures. The process includes the steps of securing a sheet of dielectric tape (11) comprising a dielectric layer and a supporting carrier layer to a frame (13), forming vias (19) in the dielectric tape, securing the frame with the dielectric tape to a via filling fixture (17), filling the vias with via fill metallization, and removing the dielectric tape from the via filling fixture. The process further contemplates filling vias of dielectric tape secured directly to an exposed surface of a hybrid circuit during the manufacturing process.

REFERENCES:
patent: 3948706 (1976-04-01), Schmeckenbecher
patent: 3956052 (1976-05-01), Koste et al.
patent: 4226659 (1980-10-01), Griffith et al.
patent: 4645552 (1987-02-01), Vitriol et al.
Desai et al., "Method of Controlling a Paste-Filled Via Diameter in a Ceramic Green Sheet", (IBM Tech. Bull.), vol. 22, No. 5, 10/1979.

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