Via-filling conductive paste composition

Details Via-filling conductive paste composition Via-filling conductive paste composition

1999-06-11

2000-06-27

Kopec, Mark

Compositions

Electrically conductive or emissive compositions

Free metal containing

174265, 174257, 174259, 523458, 252512, H01B 102

Patent

active

060803363

ABSTRACT:
A conductive paste composition, which is superior in electrical connection reliability and has properties required for a via-filling conductive paste composition is disclosed. The via-filling conductive paste composition contains a solvent in an amount of not more than 5 parts by weight per 100 parts by weight of the total amount of components A to D:

REFERENCES:
patent: 4888135 (1989-12-01), Tsunaga et al.
patent: 5914358 (1999-06-01), Kawajima et al.
patent: 5951918 (1999-09-01), Kuwajima et al.
patent: 5977490 (1999-11-01), Kawajima et al.

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