Stock material or miscellaneous articles – All metal or with adjacent metals – Having metal particles
Patent
1993-01-22
1995-06-06
Walsh, Donald P.
Stock material or miscellaneous articles
All metal or with adjacent metals
Having metal particles
428548, 428554, 252514, 420503, H01H 102
Patent
active
054221900
ABSTRACT:
The present invention provides a new and useful via fill paste for use in the construction of electronic circuit devices. The unique via fill paste is capable of electrically connecting conductive layers made of dissimilar metals such as gold and silver. The via fill paste includes gold, silver, palladium and a refractory oxide. The refractory oxide comprises one or more metals selected from the group consisting of zirconium, yttrium, niobium, tantalum, lanthanum, thorium, hafnium, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium and lutetium.
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Chi Anthony R.
Ferro Corporation
Walsh Donald P.
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