Via fill ink composition for integrated circuits

Details Via fill ink composition for integrated circuits Via fill ink composition for integrated circuits

1988-10-11

1989-09-05

Barr, Josephine

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 113, 106 122, 106 126, 252512, 252518, 252567, 501 17, C09D 1100, H01B 106

Patent

active

048635170

ABSTRACT:
A novel devitrifying frit is disclosed which has a coefficient of expansion essentially the same as that of silicon. The subject frits have a high softening temperature and excellent reheat stability which make them useful in ink formulations for forming dielectric layers in multilayer circuitry. The frits are also suitable for use as a substrate material for direct mounting of silicon chips or for use in thick film via-fill inks.

REFERENCES:
patent: 3957496 (1976-05-01), Eagan
patent: 4376725 (1983-03-01), Prabhu et al.
patent: 4377642 (1983-03-01), Prabhu et al.
patent: 4619836 (1986-10-01), Prabhu et al.
patent: 4623482 (1986-11-01), Kuo et al.

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