Via fill compositions for direct attach of devices and methods o

Details Via fill compositions for direct attach of devices and methods o Via fill compositions for direct attach of devices and methods o

1998-12-18

2000-10-24

Young, Lee

Metal working

Method of mechanical manufacture

Electrical device making

29852, 174263, 427 97, H01C 1706

Patent

active

061347728

ABSTRACT:
The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.

REFERENCES:
patent: 3601523 (1971-08-01), Arndt et al.
patent: 3983075 (1976-09-01), Marshall et al.
patent: 4008300 (1977-02-01), Ponn
patent: 4135988 (1979-01-01), Dugan et al.
patent: 4179797 (1979-12-01), Johnson
patent: 4221047 (1980-09-01), Narken et al.
patent: 4383363 (1983-05-01), Hayakawa et al.
patent: 4442966 (1984-04-01), Jourdain et al.
patent: 4552690 (1985-11-01), Ikeguchi et al.
patent: 5006673 (1991-04-01), Freyman et al.
patent: 5133120 (1992-07-01), Kowakami et al.
patent: 5191709 (1993-03-01), Kawakami et al.
patent: 5483421 (1996-01-01), Gedney
patent: 5487218 (1996-01-01), Bhatt et al.
patent: 5557844 (1996-09-01), Bhatt et al.
patent: 5758413 (1998-06-01), Chong et al.
patent: 5822856 (1998-10-01), Bhatt

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